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Precise Control of Fluids as Success Factor in the Semiconductor Industry

Liquid, gaseous, ultra-pure to highly aggressive fluids are used in semiconductor production. This includes ultra-pure water, liquid cooling media, but also acidic or caustic solutions such as hydrofluoric acid, sulphuric acid, hydrochloric acid or sulphuric acid and caustic soda or solvents. Precise measurement and control of the various liquid properties (e.g. temperature, flow rate, conductivity, pH value) is of central importance in semiconductor production. Other challenges include production in cleanrooms and the supply and disposal of process chemicals, bulk and speciality gases as well as other process media (e.g. compressed air, ultra-pure, process or cooling water).

Safe production processes in the cleanroom

Production in a cleanroom is challenging, as even the slightest contamination in the room air and process media can render the end product unusable. Continuous measurement and precise regulation and control of the ultra-pure media can prevent and ideally avoid contamination. 
Depending on the end product (e.g. transistor, LED), it is important to customise individual process parameters (e.g. flow rate, cooling circuits) to achieve the desired properties in the product and process.

Using ultra-pure media efficiently in the process 

Semiconductor production not only requires production in a cleanroom, but also the efficient handling of ultra-pure media (e.g. ultra-pure water, solvents, aggressive chemicals). Reducing the consumption of these media is generally synonymous with cost-efficient and resource-saving production. The precise control of such gases and liquids is therefore essential for modern semiconductor production. In addition, there are also legal regulations relating to the recycling and reprocessing of ultra-pure media. The efficient use of media also reduces production costs here.

Cooling in semiconductor production

A second important aspect is the specific temperature requirements that exist in the production process of semiconductor elements to be able to guarantee high and consistent product quality. Here, for example, it is important to ensure that process gases only react with the semiconductor element and not with the inner wall of the process chamber. This requires a constant gas temperature and efficient cooling of the process chamber. Such cooling systems, such as the Bürkert solution for CVD coating systems, constantly ensure the required temperature in the production process.

The same applies to controlling and maintaining the temperature of the ultra-pure water (UPW) in production, where Bürkert offers system solutions for temperature control that not only work precisely but also reliably over the entire service life of the system.

Precise and safe gas and liquid control for the subfab

The subfab is the central supply of the factory, where the preparation and post-treatment of the process media, exhaust gas cleaning and energy supply for the machines take place. All gases and liquids that the machines in the cleanroom need or no longer need for the process are controlled and monitored by the processes in the subfab. Precise fluid control in this area therefore contributes to resource-saving production overall.

Increased efficiency

Increase efficiency in the development of your machines. Our Systemhaus engineers develop a fluidics technology solution tailored exactly to your process, so that you can concentrate on your core expertise. This guarantees the optimal interplay of sensors and actuator technology in a compact system, reduces the demand for space in the machine, reduces possible leakage areas and maintenance work.

Individualised solution

You can rely on individual, high-quality fluidics systems that our experts will tailor exactly towards your requirements and slim down your process. Be it cooling processes in clean rooms or for exhaust gas post-treatment, COor Ndosing in the sub-fab, you will receive your individual solution in the highest quality. 

Process reliability

Improve your processes and process safety in gas control of CO2 or N2, in exhaust gas post-treatment, or achieve the optimal cooling solution for your PVD and CVD machines by relying on our individual system solutions. These score particularly high thanks to optimal coordination to meet your requirements, easy integrability, digital communication interfaces (e.g. IO-Link, EtherCAT), preventive maintenance functions, innovative measurement technology and a long service life. 

 

Safe, customised fluid handling for the semiconductor industry

We also analyse fluidic processes, because as fluidics experts we develop solutions for your semiconductor production applications, from customised components to individually tailored systems. Here you will find a selection - discover more in a non-binding consultation.

Exhaust gas post-treatment
The challenge: Residue-free removal of pollutants from the exhaust gas flow, against a backdrop of changing exhaust gas composition and throughput.
The Bürkert solution: Our system precisely controls the ratio of fuel gas to oxygen in a wide range of loads.
Vacuum pump
The challenge: Protecting the sensitive components of a pump from corrosive process gas by means of a continuous inert gas flow.
The Bürkert solution: Our gas inlet system reliably monitors and guides argon to the areas where aggressive or corrosive gases may impair or damage the pump function.
Carbon dioxide carbonator
The challenge: Preventing the adhesion of particles to the wafer in the sawing process as a result of static electricity, while also optimising the pH value to avoid corrosion.
The Bürkert solution: Our system precisely doses carbon dioxide into the water used for cutting in the wafer dicing machine or process.
Nitrogen overlap
The challenge: Preventing deionised (DI) water from coming into contact with carbon dioxide or other impurities from the atmosphere, and a reduction in the resistance level or the exclusion of impurities.
The Bürkert solution: Our solution for automatic nitrogen dosing with optimal fill level and flow measurement prevents contamination of the DI water and also ensures that the resistance value of ultrapure water remains stable at 18.3 MΩ.cm.
Chemical vapour deposition (CVD)
The challenge: Space-saving and efficient reactor wall cooling.
The Bürkert solution: Our compact, individually tailored cooling solution ensures a consistent temperature for the reactor wall in the CVD machine.
Physical vapour deposition (PVD)
The challenge: Space-saving and efficient cooling solution.
The Bürkert solution: Our cooling system is compact and individually tailored to suit your machine.
Air Handling Unit (AHU)
The challenge: Monitoring air quality, for example, with regards to air humidity and temperature for clean rooms.
The Bürkert solution: Our pneumatic valves control the water in cooling/heating circuits.
Wet processes
The challenge: Handling barely aggressive to highly aggressive liquids and precise dosing and analysis of process chemicals.
The Bürkert solution: Our products for conductivity, pH value and flow measurement will give you optimal results in wet etching processes. Moreover, diaphragm valves can control process liquids in your wet etching process.

Bürkert Systemhaus - Always open for fluid technology requirements in electrical and semiconductor technology

The development of reliable fluid handling solutions in the semiconductor industry is complex and time-consuming. Use the expertise of our fluidics specialists to operate more efficiently. We listen, analyse and develop pioneering products and customer-specific application solutions right through to series production. You and your projects are always welcome at the Systemhaus - on site, by telephone or virtually.

  • Manufacturing ideas

    Experienced consultants, qualified industry specialists and dedicated engineers work directly with you to develop a solution for your project-specific requirements in the semiconductor industry. Thanks to our network of five Systemhaus locations in Germany, China and the US, you can rely on flexible and efficient project management – from the initial idea to the implementation of solutions in CVD machines, PVD machines or other processes in the semiconductor sector.

    Directly to the Systemhaus

Measurably safe, measurably efficient

Cost savings

20%

Up to 20% reduction in installation costs when installing a cooling solution by Bürkert in CVD coating systems.
 

Time savings

40 Min.

Up to 40 minutes saved by installing a compact cooling solution by Bürkert in PVD machines compared to a conventional solution.
 

Efficiency

15%

Up to 15% more efficient use of resources with nitrogen.
 

 

Suitable solutions for processes in the semiconductor industry

Type 8840

Modular process valve cluster - distributor and collector

Type 8840
  • Valve cluster ready for installation
  • Compact design without any potential leakage
  • No assembly effort
  • No piping between the valves needed
  • Trusted actuators for simple automation
Type 8745

Mass flow controller (MFC)/mass flow meter (MFM) for gases

Type 8745
  • Nominal flow ranges from 20 l/min up to 2500 l/min
  • High accuracy and repeatability
  • Communication via standard signals or Industrial Ethernet
  • Electromagnetic and motor-driven valve actuation available
  • Easy device exchange through configuration memory
Type 8228

Inductive conductivity meter, ELEMENT Design

Type 8228
  • Perfect for concentrated liquids and wide conductivity ranges
  • Pre-parameterized variants available for direct start-up
  • Measuring device for direct connection to the control level (PLC) via analogue 4…20 mA signal or digital IO-Link or Bürkert system bus (büS)/CANopen communication
  • Simulation of process values for diagnostics
  • Variants of the sensor available in PP, PVDF or PEEK

From practice – our solutions for the semiconductor industry

Learn more about our products and solutions – or speak directly to our experts.